Prime Wafers

 

Materials Fused Silica, Borofloat, B270 , BK7, Eagel XG, etc
Diameter 5-350 mm
Shape

Round

Square

Thickness >50 um (depends on diameter)
Surface

<10/5 to 60/40

Surface quality (MIL-0-13830) S/D

<10/5 to 60/40 (depends on diameter)

Roughness

Polished side Ra<1nm

TTV <2um (depends on diameter)
LTV(5x5mm) <2um

Services

Machining: square and round holes: >1mm (accuracy 0.025mm)

Other services, please check our Service page

Remarks Other specs are possible
   

Ask for quotation