PrimeWafers

 

Diameter 2 to 6 inch (other diamentions possible)
Thickness >60um (depends on wafer diameter)
TTV <5um (depends on wafer diameter)
Cut Angle X / Y / Z / AT / ST / 36Y / 42Y / 48Y / 64Y / 128Y, etc
Finish Single Side Polished(SSP) /Double Sides Polished(DSP)
Polished surface roughness <1nm

Thin films

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Processes

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