Prime Wafers

 

Material 99,996%, High Purity, Monocrystalline, Al2O3
Orientation

C- plane (0001) towards M-plane (1-100),

A-plane(1 1-2 0) 0.2±0.1° /0.3±0.1°,

R-plane (1-1 0 2), 

M-plane(1-1 0 0),  etc.

Diameter 2-6 inch
Thickness >250um (depends on wafer diameter)
Front Surface Epi-polished, Ra < 0.2 nm (by AFM)
Back Surface

Fine ground, Ra = 0.8 μm to 1.2 μm, or

Epi-Polished (Ra< 0.2nm) (by AFM)

Services

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Remarks Other specs (orientation, thickness, etc) are possible
   

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